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A distributed case- and project-based learning to design 3D lab on electronic engineering education


Yang, W and Yuan, N and Chinthammit, W and Kang, B, A distributed case- and project-based learning to design 3D lab on electronic engineering education, Computer Applications in Engineering Education, 27, (2) pp. 430-451. ISSN 1061-3773 (2019) [Refereed Article]

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Copyright 2019 Wiley Periodicals, Inc.

DOI: doi:10.1002/cae.22087


Recently, virtual laboratories have popping up in online learning for students to self‐enroll in the experiments. Like in‐class teaching methodology, virtual laboratories need to meet the requirements as same as real world laboratories and support efficient learning and communication services. In this paper, we detail the development of our distributed 3D lab system based on case‐and project‐based learning method, which support semi‐automatic experiment creation, assessment and knowledge‐based instant conversation. We demonstrated the potential of our system with a case study in a subject of electronic engineering. The preliminary results indicated that our system demonstrated the potential of providing flexible assessment, saving time, improving experimental skills and making students more confident.

Item Details

Item Type:Refereed Article
Keywords:3D, case- and project-based learning, electronic education, knowledge-based, teaching methodology
Research Division:Information and Computing Sciences
Research Group:Distributed computing and systems software
Research Field:Distributed computing and systems software not elsewhere classified
Objective Division:Information and Communication Services
Objective Group:Other information and communication services
Objective Field:Other information and communication services not elsewhere classified
UTAS Author:Yang, W (Ms Wenli Yang)
UTAS Author:Yuan, N (Mr Nanqi Yuan)
UTAS Author:Chinthammit, W (Dr Winyu Chinthammit)
UTAS Author:Kang, B (Professor Byeong Kang)
ID Code:137568
Year Published:2019
Web of Science® Times Cited:5
Deposited By:Information and Communication Technology
Deposited On:2020-02-20
Last Modified:2020-06-12

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