File(s) under permanent embargo
Three-dimensional printing of abrasive, hard, and thermally conductive synthetic microdiamond-polymer composite using low-cost fused deposition modeling printer
journal contribution
posted on 2023-05-20, 03:45 authored by Waheed, S, Cabot, JM, Petr SmejkalPetr Smejkal, Farajikhah, S, Sayyar, S, Innis, PC, Beirne, S, Barnsley, G, Trevor LewisTrevor Lewis, Michael BreadmoreMichael Breadmore, Brett PaullBrett PaullA relative lack of printable materials with tailored functional properties limits the applicability of three-dimensional (3D) printing. In this work, a diamond–acrylonitrile butadiene styrene (ABS) composite filament for use in 3D printing was created through incorporation of high-pressure and high-temperature (HPHT) synthetic microdiamonds as a filler. Homogenously distributed diamond composite filaments, containing either 37.5 or 60 wt % microdiamonds, were formed through preblending the diamond powder with ABS, followed by subsequent multiple fiber extrusions. The thermal conductivity of the ABS base material increased from 0.17 to 0.94 W/(m·K), more than five-fold following incorporation of the microdiamonds. The elastic modulus for the 60 wt % microdiamond containing composite material increased by 41.9% with respect to pure ABS, from 1050 to 1490 MPa. The hydrophilicity also increased by 32%. A low-cost fused deposition modeling printer was customized to handle the highly abrasive composite filament by replacing the conventional (stainless-steel) filament feeding gear with a harder titanium gear. To demonstrate improved thermal performance of 3D printed devices using the new composite filament, a number of composite heat sinks were printed and characterized. Heat dissipation measurements demonstrated that 3D printed heat sinks containing 60 wt % diamond increased the thermal dissipation by 42%.
Funding
Australian Research Council
History
Publication title
ACS Applied Materials and InterfacesVolume
11Issue
4Pagination
4353-4363ISSN
1944-8244Department/School
School of Natural SciencesPublisher
American Chemical SocietyPlace of publication
United StatesRights statement
© 2019 American Chemical SocietyRepository Status
- Restricted